Radiation-resilient embedded design

Lead academic: Professor Klaus McDonald-Maier
Partner lead: University of Essex                                                                                                                                                    Industry collaboration: NASA JPL, STFC/RAL, NNL, UltraSoC Technologies

Work package three will develop new methods for increasing the resilience of embedded systems (hardware and software) to provide redundancy, resilience and robustness against radiation damage, including error checking and ‘self-healing’ approaches translated from aerospace and high-performance computing.  The overall aim is to extend lifetimes and increase reliability of sensors processing and robotic control systems in radioactive environments.